Application of plasma cleaning machine in the process of integrated circuit manufacturing

　　Plasma cleaning machine is a green and pollution-free high-precision dry cleaning method that can effectively remove surface pollutants and avoid electrostatic damage. In the process of integrated circuits, many types of pollutants will be generated, including fluorinated resins, oxides, epoxy resins, solders, photoetchants, etc. These pollutants will seriously affect the reliability and qualified rate of integrated circuits and their components. Plasma cleaning is a process technology that can effectively remove surface pollutants and is widely used in the process of integrated circuits.

Plasma is a state of existence of matter. Usually, matter exists in three states: solid, liquid, and gas, but in some special cases, there is a fourth state, such as matter in the ionosphere in the earth's atmosphere. The following substances exist in the plasma state: electrons in high-speed motion; neutral atoms, molecules, and atomic groups (free radicals) in an activated state; ionized atoms and molecules; unreacted molecules and atoms, etc., but the matter generally remains electrically neutral.

Application of plasma cleaning machine in metal degreasing and cleaning:

Metal surfaces often have organic matter such as grease and oil and oxide layers. Before sputtering, painting, bonding, bonding, welding, brazing and PVD, CVD coating, plasma treatment is required to obtain a completely clean and oxide-free surface. Before welding operation: printed circuit boards are usually treated with chemical flux before welding. After welding, these chemicals need to be removed by plasma method, otherwise corrosion and other problems will occur.

Before bonding operation: good bonding is often weakened by residues during electroplating, bonding and welding operations, which can be selectively removed by plasma method. At the same time, the oxide layer is also harmful to the quality of bonding, and plasma cleaning is also required.

Plasma cleaning machine does not need to use a large amount of acid, alkali, organic solvent, etc., will not cause any pollution to the environment, is beneficial to environmental protection and personnel safety, and the uniformity, repeatability and controllability of this cleaning technology are very good, with three-dimensional processing capabilities, and direction selection can be performed. Its characteristics are that there are no positive and negative electrodes, the self-bias voltage is very small, no discharge pollution is generated, and electrostatic damage is effectively prevented; the plasma density is high and the production efficiency is high; the impact of ion movement is small and no UV (ultraviolet) radiation is generated, which is especially suitable for process cleaning of some sensitive circuits.