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CIF focuses on material surface treatment technology, providing customers with professional instrument equipment and application process solutions for cleaning, debonding, etching, coating and other aspects!The 11th analytica China in Munich came to a successful conclusion on July 13, 2023 at the National Exhibition and Convention Center (Shanghai). As a beacon exhibition in the laboratory industry, this year's analytica China has provided the industry with a grand event for technology and thinking exchanges, insight into new situations, grasp new opportunities, and discuss new developments.
This year's exhibition brought together 1,273 exhibitors and partners (2020: 1,121) and 56,864 professional visitors (2020: 23,652). The eight exhibition areas with a total display area of nearly 80,000 square meters (2020: 60,000 square meters) presented 900+ new products and new technologies, innovative technologies and cutting-edge solutions.
At this exhibition, CIF's new plasma degumming machine and RIE reactive ion etching machine came out, attracting many experts and industry professionals to stop and consult. The plasma degumming machine launched by CIF has a beautiful appearance and strong practicality, which has triggered discussions among experts and teachers. It adopts the inductively coupled isotropic (in all directions) plasma excitation method, which is suitable for plasma degumming of all substrates and complex geometric configurations. It is particularly suitable for universities, research institutes, and microelectronics and semiconductor enterprise laboratories. It can remove photoresists such as polymer stripping, metal stripping, and mask materials from substrates before or after dry or wet etching for sacrificial layers in the manufacturing process of circuit boards, epitaxial wafers, chips, epoxy resins, and MEMS, as well as wafer surface pretreatment.
At the same time, there is another product that is also loved by experts and teachers, the RIE reactive ion etcher, which adopts the RIE reactive ion induced excitation method to realize the anisotropic microstructure etching of the material surface. It is particularly suitable for universities, research institutes, microelectronics, and semiconductor enterprise laboratories to conduct research on dielectric etching, silicon etching, metal etching, and metal etching. It has low cost of use, high cost performance, easy maintenance, and fast and efficient processing. It is suitable for RIE reactive ion etching of all substrates and complex geometric configurations.
Domestic instruments gather "Chinese power" and help the rise of national trends
CIF always adheres to the customer-centric and market-oriented development concept of technology-led and service-driven, actively responds to the relevant policies of the national scientific instrument "domestic substitution", and in accordance with the concepts and requirements of "production, learning, research, use" and "specialization, precision, specialization, and innovation", continuously expands R&D and manufacturing investment, and develops towards intelligent manufacturing of the entire industrial chain.
CIF hopes to make a contribution to my country's cutting-edge science and technology and high-end instrument and equipment research and development through its continuous strengthening.
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