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CIF focuses on material surface treatment technology, providing customers with professional instrument equipment and application process solutions for cleaning, debonding, etching, coating and other aspects!
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Circuit Board

Time:2023-06-01      Click Count:118

Plasma cleaning is used in circuit boards for HDI board processing, FPC board processing, hard-flex board processing, Teflon board processing, BGA pre-mounting processing, circuit board silver glue pre-cleaning, wire bonding, multi-layer flexible board FPC glue residue removal, hard-flex board PCB residual glue removal, high aspect ratio FR-4 hard board micro-hole removal and lamination pre-processing, etc.

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