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CIF Powder Plasma Cleaners

Category: Plasma Cleaners

Product Parameters

The CIF powder-specific plasma cleaning machine is specially designed for fine materials such as powder and particles. It breaks through the technical bottleneck of traditional vacuum plasma equipment when handling powder samples, and can efficiently process ultra-fine powder at the micron and even nanometer level. At the same time, it is fully compatible with the high-quality cleaning and surface treatmen requirements of conventional materials.
Attribute
Product Name
Model
Manufacturer Nature
Visits
Time
Details
CIF Powder Plasma Cleaners
CPCP3plus
Manufacturer
849次
2024-03-18

Products Details

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Why choose plasma treatment for processing powders?

Traditional methods are difficult to uniformly and efficiently process fine powders. The CIF powder plasma cleaning machine, through non-contact and low-temperature plasma technology,precisely and controllably modifies only the surface of the powder while fully maintaining its original properties. It is a key process for enhancing the added value of powders and expanding their application boundaries.

Working Principle

The equipment is equipped with a dedicated sample bottle that can rotate and stir in a specially designed vacuum chamber. High-energy plasma is generated by the radio frequency power supply, creating an active environment inside the bottle. The powder is fully and evenly exposed in all directions through continuous rotation and stirring. Through physical bombardment and chemical reactions by the plasma, dynamic and uniform treatment is achieved, resulting in the targeted optimization of surface properties.

Four processing effects enhance powder material performance

Controllable wetting property conversion: Achieving on-demand changes in surface hydrophilicity and hydrophobicity.

Enhanced dispersion and compatibility: Significantly improving the dispersion stability and interfacial adhesion of powders in different media (water or organic solvents).

Introduction of active functional groups: Grafting new chemical groups (such as -OH, -NH₂ , etc.) onto the surface without damaging the bulk, endowing new properties.

Cleaning and activation: Effectively removing surface organic contaminants and activating surface energy, enhancing the performance of subsequent coating, bonding, and other processes.

Applications

Powder plasma cleaning machine is mainly used in the following fields.

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Surface modification of organic powder materials: The surface properties of organic polymer  powder materials can be enhanced through plasma treatment, which involves the use of  discharge gases such as argon (Ar), helium (He), oxygen (O2), nitrogen (N2) or air. This  process allows for the introduction of active functional groups on the powder's surface  without compromising its internal structure, resulting in increased hydrophilicity. Such  modification is crucial for subsequent processing and application of the powder.

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The adjustment of surface bond energy in polymer powder materials: Because polymer  powders generally have weaker surface bond energies than inorganic powders, they are  more susceptible to plasma treatment. The control of the treatment time and plasma  strength is particularly important to obtain the ideal treatment effect. By plasma treatment,  the wettability of the powder surface can be improved, its bonding strength with binders or  other materials can be increased, and organic pollutants on the surface can be removed.

The susceptibility of polymer powders to plasma treatment is attributed to their relatively  weaker surface bond energies compared to inorganic powders. Therefore, precise control  over treatment time and plasma strength becomes crucial for achieving the desired treatment effect. Plasma treatment enhances the wettability of powder surfaces, increases  their bonding strength with binders or other materials, and effectively eliminates organic  pollutants from the surface.

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The utilization of plasma surface treatment for the functionalization of powder materials: The  plasma surface treatment technology enables the functionalization of powder materials'  surfaces, including grafting, cross-linking, coating, and other processing techniques. The  active particles generated by plasma react with the powder's surface, introducing new  functional groups or altering the surface structure to impart novel characteristics.

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The plasma treatment of powder materials is a crucial technique for material preparation, as  well as the development of new materials, processes, and new products. This method not  only enhances the surface properties of powder materials but also increases their valueadded potential and broadens their application scope.

Function & Features

1. Intelligent Control: Equipped with a 7-inch bilingual touch screen (Chinese & English) for real-time monitoring and automatic adjustment of process parameters. It stores 20 preset formulas and runs in both manual and automatic modes via PLC. All formulas and operational data can be saved and fully traced.

2. Precision Pneumatic Control: Adopts two-way intelligent vacuum control. Vacuum level can be precisely regulated by either gas flow or chamber pressure, enabling flexible process adjustment to meet diverse precision processing requirements.

3. Shower-Type Air Inlet: Multi-channel air intake design solves the uneven airflow issue of traditional single-hole structure, ensuring consistent processing results.

4. Dynamic & Non-damaging Treatment: Features dynamic stirring for cleaning. It operates at low temperature without damaging materials, achieves efficient powder homogenization with zero environmental emissions.

5. Anti-contamination Design: Built with HEPA filtration and back-purging function to prevent secondary pollution.

6. Multiple Safety Protection:The system cuts off power automatically when the chamber door is opened, fully protecting operators and samples.

7. Wide Compatibility:Multi-functional unit compatible with inorganic, organic and composite powders for extensive application scenarios.

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