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CIF Spin Coater

Category: Spin Coaters

Product Parameters

Spin coater can be widely used for surface coating of microelectronics, semiconductors, new energy, chemical materials, biological materials, optics, silicons, slides, wafers, substrates, ITO conductive glasses and other process plates.
Attribute
Product Name
Model
Manufacturer Nature
Visits
Time
Details
CIF Spin Coater
SC1
Manufacturer
88次
2024-01-17

Products Details

Function & Features 

The CIF spin coater utilizes a closed-loop control servo motor with digital signal  feedback for speed adjustment, ensuring precise and uniform coating distribution. 

The equipment is equipped with a 7-inch full-color touch screen and an intelligent  programmed controller. It comes with 10 preset coating protocols as standard, allowing  users to define the spin speed and time. Additionally, there are 20 optional coating  protocols available, each consisting of 10 steps for a total of 100 segments. 

The incorporation of a built-in horizontal calibration device guarantees the consistency  of the coating. 

Multi-safety protection mechanism:  

- Electromagnetic safety switch stops the chuck in case of cover is opened.  

- Self-locking function prevents the personal injury caused by flying substrates or  bounced off cover. 

 - Double security top cover with polytetrafluorochimeric tempered glass avoids hurts  caused by flying pices of glass or acrylic cover.  

The triple seal safety protection mechanism between the sample tray and its bayonet  effectively minimizes the risk of solution entering the motor. 

One machine, two purposes. Both vacuum chuck and non-vacuum chuck are available;  

The sample tray is designed ergonomically for effortless operation. 

The stainless steel housing, toughened glass cover, acid-alkali resistant PTFE chamber,  and polypropylene (NPP-H) chuck collectively ensure optimal operation in a variety of  harsh conditions. 

The design features an upper and lower double chamber configuration - the upper  chamber facilitates easy removal of residual solution, while the lower chamber serves  as a collection point for waste solution.

Optional features include nitrogen purging, nitrogen protection, automatic dispensing,  or a simple dispenser. 

The materials suitable for processing include silicon wafers, glass, quartz, metals such  as GaAs and GaN, InP, and other similar substances.


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